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This research proposes a Case-Based Reasoning (CBR) system to infer the principal process parameters for a new PCB product.
In addition, the influences of principal process parameters on the thermal profiles of the deposit have been analyzed and discussed.
Although numerous process parameters must be determined before fabrication, only a number of parameters called principal process parameters because they affect the quality of a PCB product.
The plasma 2nd gas (H2) flow rate and spraying distance were used as principal process parameters which controlled the heat enthalpy (heat input).
As long as the principal process parameters are identified efficiently and controlled well, the manufacturing lead-time can be shortened and the quality of the new PCB product can be assured.
A laboratory scale pertractor CFP-50 was used to study the effects of pertractor CFP-50 wasameters on pertraction efficiency in the case of copper transport across a membrane of parafinic oil, containing 2% (vol).
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Moreover, multi-objective optimization was performed using a hybrid approach combining TOPSIS (Technique for order preference by similarity to ideal solution) with PCA (principal component analysis) to identify optimal process parameters.
Once, we find an optimal combination of TC process parameters and the principal significant parameter for TD and TFC of TBC, the final step would be to verify the practicability of proposed Taguchi design method based GRA by carrying out some validation tests.
Those principal observations were connected to easily available process parameters like discharge voltage and oxygen partial pressure.
According to the determined parameters, principal reactions occurred in the process, and other process parameters obtained by industrial practice, mass balances were conducted and all flow rates were calculated.
Saha and Mondal (2016) applied an optimisation technique combining Grey relational analysis with principal component analysis to identify the optimal combination of process parameters in WEDM for machining nanostructured hard facing materials.
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