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The grains were mechanically dehulled and polished using a mini-polisher.
Grain was harvested at maturity, dehulled (THU35A Test Husker, Satake) and polished using a home-made polisher.
The tooth sections were carefully polished using a polishing unit (Kent 4, automatic lapping and polishing unit) by aid of silicon carbide (SiC) grinding papers (CarbiMetTM) from coarse to fine as follows (P600, P1000, P2500, and P4000).
The windshield, mirrors, and lenses are polished using cerium oxides.
Primary and associated contigs were polished using Quiver5.
Subsequently, the samples were polished using polishing cloth and diamond suspension waterbase (MetprepTM) as follows (3, 1, and 0.25 µm).
It can be polished using cloths loaded with finer-grained abrasives such as diamond, iron oxide, or ceria.
To reduce this roughness, films have been polished using Chemical Mechanical Polishing CMPP).
For the analyses, one half of the cut crystal was polished using SiC and alumina abrasives of different particle sizes to obtain a mirror-finish surface.
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The part was pre-polished using an R200 bonnet shown in Fig. 16 (a).
Patch pipettes were pulled from thick walled borosilicate glass capillaries (Harvard Apparatus, UK) using a PP830 puller (Narishige, Japan) and the tips were heat-polished using a MF830 micro-forge (Narishige, Japan) to achieve 3 6 MΩ resistance.
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