Dedicated printed circuit boards have been designed with different geometrical configurations (plating thickness, drilled hole diameter and PCB thickness).
Both plating thickness and thermal treatment were evaluated to determine the effects of these fabrication parameters on oxidation performance and to identify an optimal surface modification process.
The results confirm that for rigid flex boards, the fatigue life of vias increases with higher plating thickness, larger drilled hole size and lower PCB thickness.
It is well known that solder joint reliability is affected by many factors, such as the size of chip, joint stand-off height, pad design, test board surface finish, substrate gold plating thickness and the utilization of underfill material, etc.
A Taguchi analysis indicated that higher fatigue life can be achieved by using high Tg and low CTE bonding material, increasing the plating thickness, reducing the board thickness and increasing the drill hole size.
Three sets of electrodes, namely Pt electroplated Ti (PET) and diffusion annealed PET (DAPET) of plating thickness 3, 5, 7 and 10 μm and thermochemically glazed mixed oxide coated titanium anode (MOCTA-G) were evaluated for their performance, with a view to optimizing the current density conditions for maximum efficiency during the electrolytic destruction of nitric acid.
