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Plating solution: 0.01 M FeCl2/0.1 M LiClO4/formamide (LiClO4 as supporting electrolyte).
The nickel/nickel oxide thin films were deposited via electrolysis and the quality was evaluated via the effect of the sulfate concentration, plating temperature, plating solution pH, and heat treatment.
Acetate buffer Bi III) plating solution.
LiBr/ HCl Bi III) plating solution.
A volume of 3 mL of plating solution was added into the cuvette followed by 20 60 μL of seeded precursor.
Most BiFEs have been plated from acetic buffers, although Krolicka et al. used a plating solution of Bi(NO3 3 (0.02 M), LiBr (0.5 M), and HCl (1 M) with a plating potential of −0.25 V for 45 s [addition of bromide and strong acid enabled a highly concentrated Bi III) plating solution to be produced].
The plating solution contains Cu and Ni ions.
The Au plating solution (Oromerse Part B) was purchased from Technic, Inc. (USA).
The plating solution was aged for 48 h before using it to fabricate the nanoshells.
PbO2 thin films were prepared by pulse current technique on Ti substrate from Pb NO3 2 plating solution.
Thirdly, Co nanoparticles are deposited around the Pd active centers in an electroless plating solution to obtain Co/TiO2.
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