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Recently, Huang, et al., showed that the directional effect may be further altered by substrate or plating conditions.
The results are compared to measurements of roughness and porosity measured under plating conditions.
Electrochemical processes and plating conditions of aluminium room temperature haloaluminate molten salts are described.
Based on qualitative analyses of the skipping and overplating phenomena rules of thumb for the solder mask design based on the plating conditions are proposed.
This paper presents the optimum chromium plating conditions which produce the possible thickest and brightest coatings and detailed information about the interaction between process parameters.
The drawbacks of measuring these properties at the plating conditions (high ionic strength media and temperature) were discussed.
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Therefore, an optimum designing of electroplating machine and reasonable selecting of plating condition is highly required.
For each cross and each experimental repeat and each plating condition, we counted at least 100 colonies to determine the respective titers.
Nickel was electroplated using a nickelsulfamate electrolyte under pulse-plating conditions.
Results are compared for different additives for continuous plating and pulse-plating conditions.
In contrast, when using an organic-free Watts' bath and similar pulse-plating conditions, the grain size can only be refined down to about 80 100 nm.
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