A modeling methodology was developed to study the Cu plating uniformity on the wafer scale.
The wafer scale plating uniformity with thin Cu seed layer was studied.
The plating uniformity and seed layer corrosion were studied for various seed layer thicknesses using the proposed modeling approach.
Bottom-up copper pillars and fine line patterns with plating uniformity were fabricated to meet the requirement of an accurate impedance and the high density interconnection for IC substrates.
To verify cell plating uniformity, a post-attachment scan was taken after cell attachment and the PWV shift image was determined by subtracting the baseline image from the post-attachment image.
With applying the diversion plate, the uniformity of flow rate and fuel gas mixing of different ejectors is increased by 1.9%and2.2%2%, respectively.
With applying the distribution orifice plates, the uniformity of velocity and fuel gas mixing of single ejector is increased by 234.2% and 2.9%, respectively.
To calculate uniformity from plate to plate and from screening batch to batch, the Z′ value was calculated for high-throughput screening (Iversen et al, 2006).
Uniformity: uniform cylindrical phantom.
Treatment times in excess of 1 s resulted in a reduction of the nickel plating deposition rate, uniformity and adhesion values.
The results indicate that the gravitational flat-plate heat pipe has considerable advantages over the metal plate in the temperature uniformity.
