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b Thin down passive area with plasma etch.
The twisting angle of 3D kinematic motion is constrained by the passive area even the active areas are controlled differently.
However, the passive area of the fin is still Nafion membrane, which is not as stretchable as PDMS material.
It has been found that during pit growth the conventional EIS consists of the contribution of the pit and the surrounding passive area.
This approach has proven to be very useful since the conventional impedance spectroscopy (EIS) consists of a combination of the contribution from the passive area as well as a contribution from the active pit which are not easy to separate.
The passive area (or textures) refers to the non-grinding area where no grain is located at and the main functions of it include serving as reservoirs to transport more coolants/lubricants into the grinding zone and providing larger chip disposal space.
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First, the passive areas can substantially constrain the motion of the active areas.
Remove PR and lift off the gold on the passive areas.
An effective, precise approach is needed for tailoring the stiffness of the passive areas.
The assembly-based approach solves the problem in the passive areas since a soft and stretchable PDMS can be selected in those areas.
The future direction of fabricating 3D deformable membrane would be 3D printing other soft materials and Nafion film into a seamless and arbitrary-shaped membrane which will consist of active areas and passive areas.
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