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Twenty circles with an angular pitch of 0.1° correspond to 2° on either side of the reference direction which is parallel to the flat.
The ductility of specimens with the shear plane parallel to the flat grain was less pronounced as it was affected by the relatively brittle lignin material of the middle lamella.
Highest values were obtained for the shear plane parallel to the end grain, intermediate values for the plane parallel to the flat grain and lowest values for the plane transverse to the flat grain.
In particular, the heat transfers well through the x-direction, the direction parallel to the flat surface of the coin-shaped insulation; however, the less heat flows through the z-direction than other (x and y) directions because the flat surfaces of the coin-shaped insulations disrupt the heat flow.
In the left figures of Fig. 7, the stress distributions are relatively uniform over the whole specimen when the loading is applied to the direction that parallel to the flat surfaces of the coin-shaped insulations (x-direction), although the vicinity of the insulations shows less stress values than other parts.
Comparing the directional material properties, it is demonstrated that the thermal conductivity is smaller when heat flows in the direction perpendicular to the flat surface of the coin-shaped insulation, while the strength is larger when the loading direction is parallel to the flat surface.
Similar(54)
At low shear rates, the semiflexible chain keeps semirigid conformation in the plane parallel to the infinite flat wall.
If the ⟨110⟩ direction lies within ±1° of the wafer flat, the circular patters should cover an arc of 2° on both side of the reference direction which is parallel to the wafer flat.
The square opening corresponding to this mis-orientation angle on the alignment accessory pattern is the one beside the 0th ridge which is essentially parallel to the wafer flat.
In earlier attempts to precisely identify the ⟨110⟩ direction, Ciarlo fabricated a fan like structure with rectangular openings of sides 8 μm by 3 mm with longer length parallel to the wafer flat (⟨110⟩ direction) [106].
The results obtained from these techniques indicate that, during the course of deformation, the naphthalene groups, which are large and highly planar, rapidly align their broad faces parallel to the surface of the flat film.
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