Sentence examples for packaging substrates from inspiring English sources

Clif Reichard ([email protected]) is a sales consultant in his 55th year selling rigid packaging substrates.

Clif Reichard ([email protected]) is a sales consultant who has sold rigid packaging substrates for more than five decades.

Packaging substrates play a significant role in the development of large-scale integrated circuit.

An ultra-thin high-density LSI packaging substrate, called multi-layer thin substrate (MLTS), is described.

These results reveal that the composite may be the futuristic candidate for high performance electronic packaging substrate.

In order to improve the strength of surface-bonding FBG, packaging substrate in metal slice is designed and applied.

Near the corners of a silicon die, shear stresses arise due to thermal expansion mismatch between the silicon and the packaging substrate.

The use of such a standardized, paper-based packaging substrate as material for printing electronics is challenging in terms of its high surface roughness and high ink absorption rate, especially when depositing very thin films with inkjet printing technology.

An ideal high performance poly etheretherketone) (PEEK /AlN composite that has unique combination of anisotropic linear coefficient of thermal expansion (CTE) and dielectric properties was developed for the use in electronic packaging substrate as an alternative of conventionally used epoxy/E-glass substrate.

In this study, a general analytical solution is used to study the whole temperature field of LED packaging substrate, this solution is based on the method of variable separation for thermal spreading resistances of eccentric heat sources on a rectangular flux channel.

Warpage of thin package substrates and their in-plane orientation at room temperature were studied, focusing on the thermo-elastic properties of woven-fabric (WF /epoxy laminates.