Sentence examples for packaging manufacturing from inspiring English sources

The optimal packaging manufacturing process for driver IC for micro HDD is chip scale package (CSP).

Innovations and key trends for metal packaging manufacturing processes, can body design and closure/end design are discussed.

For example, to launch new, lower-cost products that helped change the game in Brazil, P&G developed small innovations in packaging, manufacturing, customer relationships, and communication methods.

The following ideas go easy on the resources required for wrapping, packaging, manufacturing and shipping (not to mention operation and eventual disposal) in favor of outdoor adventure, local activities, good food, learning and entertainment.

In the case of my client, we discovered there was no forum to bring together all of the commercial functions — regulatory, packaging, manufacturing, and marketing — to discuss potential problems with ongoing projects.

With a strong expertise in product design engineering and development, PCH Lime Lab guides companies large and small through all phases of product creation: from opportunity, to concept, to design engineering and development, to packaging, manufacturing and the customer out-of-box experience.

Concepts such as abrogated preclinical development packages, manufacturing design space, and seamless trial designs may facilitate this process.

The properties of encapsulant materials are critical in determining the suitability of the materials for specific encapsulation techniques, packaging designs, manufacturing processes, and electronics applications.

With increasing concerns about environmental protection and garbage handling, natural renewable materials such as starch, cellulose and other natural fibers become more and more popular in packaging materials manufacturing.

But this change has serious consequences for the structural integrity of the IC interconnects after processing and package manufacturing.

Thermoplastic resins, such as Liquid Crystal Polymers (LCPs), have many attractive properties for microelectronic cavity package manufacturing (in particular low gas permeation and low dielectric constant).