The big-package approach to economic stabilization was most famously demonstrated in the 1994-95 Mexicrisisisis.
Pushing so much up to summit meetings encourages a "package" approach that often wraps up unrelated issues in gargantuan and indigestible compromises.
Egypt needs agreement on the implementation of the 1995 Resolution at the 2010 RevCon, and suggests a package approach to the issue that would include Iran, Israel, and regional security.
Rather, an integrated policy package approach is needed [10].
This paper presents design issues of a novel three-dimensional packaging approach for power modules.
In this paper, we demonstrate a novel silicon-based packaging approach by using 3D integration with general semiconductor techniques.
The goal is to provide a packaged approach so that users don't have to do the work every time, which should help speed up implementation.
The dual package approach is one that makes plenty of sense, and probably what the company should have plumped for initially.
This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components.
Applying a package approach [67] could allow several targets to be met, ensuring that we meet not only the likely but also the desirable outcomes.
