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Exact(25)
Data presented is organized by variety, package type, and date.
The IAEA requirements for type IP2 (Industrial Package Type 2) packages include to carry out free drop tests that represent normal conditions of transport.
Each package type could be with or without fiber attached, and the fiber could be multimode or single-mode type fiber.
The addressed failure mode of passivation cracks is found to depend on the package type or family: for exposed pad packages this failure mode is easier to occur.
A series of experiments are conducted to investigate the effect of the package type on occurrence of passivation cracks in IC structures.
The DC/DC μModule family is designed with careful attention to the layout of its internal components, package type, and electrical operation, which ease thermal management of a very dense power supply circuit.
Similar(35)
Containment principles are described for the package types.
The experimental method can also be used for the other package types in the microelectronics industry.
SECT for different package types were obtained from the cooling experiments.
Standardized package types, as for instance ball grid array packages, are equipped with a directly injected cooling support.
CDM circuit simulation is compared to the measurement results of variations of this circuit in two different package types.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com