Sentence examples for package solutions from inspiring English sources

Exact(8)

"We have a tremendous opportunity to align and package solutions together," he said.

"We have this entrepreneurial culture in this country where self-appointed experts whip up an anxiety and then try to package solutions without necessarily testing them," she said.

This is important when existing bump technologies are used for flip chip package solutions with increased solder reflow requirements.

In this context, we manufactured and qualified two "green" package solutions: lead-free low-profile fine pitch ball grid array (LFBGA) and polymer stud grid arrays (PSGATM) area array packages.

In the future, handset OEMs will buy "package solutions", consisting of application processors (e.g. Apple's A4, which give mobile phones computing power for handling software and applications), integrated connectivity chipsets (GPS, Wi-Fi, FM, Bluetooth, NFC), and multifunction radios all from one vendor.

In addition to the low cost of fossil fuels and emission permits, other reasons for the slow market penetration of solar thermal technologies for industrial process heat applications are the lack of awareness within industry that such technologies exist, along with the lack of standard package solutions.

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Similar(50)

July 20: With its plutonium safely hidden, North Korea begins to pressure the U.S. to negotiate a package solution to the crisis.

After Mr. Bush read it this spring, administration officials started to include human rights as part of any package solution to halt North Korea's nuclear weapons program.

On May 28, Eni said it had reached "a package solution" with Sonatrach for 2013 and 2014, though it gave few details.

After refusing to discuss the nuclear issue here at all on Tuesday, the North Korean delegation today urged Japan to come up with a "package solution" to normalization, implying large amounts of financial aid.

This paper presents a chip-on-glass (COG) package solution for CMOS image sensors based on highly precise and reliable bumping and flip-chip bonding techniques.

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