Sentence examples for package performance from inspiring English sources

The 2008 compliance assessment for the license application incorporated the influence of the seismic scenario class on waste package performance.

This unique package design also provided a complementary way to work with getters to enhance the vacuum package performance and reliability of hermeticity.

Package performance analysis currently lacks an integrated approach for simultaneous and quantitative evaluation of product cooling rate, box ventilation, product quality and shelf life, box mechanical strength and energy consumption of the ventilation system.

The active package was successfully developed, and the proposed model was satisfactorily used to detect the key factors that govern the package performance, and also to improve the package design by modifying the thickness distribution of the multilayer active film.

Future prospects for modelling MAP are highlighted, including the importance of an integrated modelling approach for improved understanding of package performance for fresh and minimally processed produce under MAP.

With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.

In order to simultaneously handle chip and package performances, co-design of chip and package is a widely adopted solution, particularly because the finger/pad locations significantly affect IR-drop of the core and the package routing.

They have a small IVH Inner Via Holee) diameter to improve electrical packaging performance.

Although significant improvements have been achieved, a balance among environmental concerns, economic considerations and product packaging performance is still lacking.

In order to logically design equipment for manufacturing and packaging operations, and to simulate manufacturing and packaging performance (for example, using discrete or finite element modeling approaches), it is necessary to quantify the magnitude of the kinetic friction.

A thorough comparison of these packages' performance with datasets of different properties falls beyond the scope of this study, however before considering issues relating to power and experimental design, it is important to investigate whether packages for DE analysis give the correct type I error rate under the null hypothesis of no DE.