Sentence examples for package failure from inspiring English sources

Under extreme conditions, our study suggests that vapor pressures can attain high enough levels to drive the voids to grow to rupture, thereby causing package failure.

The LED package failure structure such as interface defect between solder and cup-shaped copper is able to forecast without destructive measurement.

The relationship between thermal resistance analysis and LED package failure structure is build with T3Ster thermal transient tester and scanning electron microscope (SEM).

Combined with transmission protocols that allow package failure recognition, the particular concept of cluster availability of the Markov modes becomes appealing.

This presentation describes uncertainty and sensitivity analysis results for the early waste package failure scenario class and the early drip shield failure scenario class obtained in the 2008 YM PA.

The conceptual structure and organization of the 2008 YM PA is based on decomposing the analysis into the following scenario classes: nominal, early waste package failure, early drip shield failure, igneous intrusive, igneous eruptive, seismic ground motion, and seismic fault displacement.

Moisture-induced package failures such as interfacial delamination and pop-corn cracking are common failure phenomena that occur during the solder reflow process in the semiconductor industry.

A constant failure rate typically describes a majority of non-solder joint related package failures in the accelerated testing or the field application.

A three dimensional finite element model is developed to simulate the solder interconnect and electronic packaging failure under board-level drop impact.

This presentation describes the determination of expected dose to the reasonably maximally exposed individual (RMEI) specified in the NRC regulations for the YM repository for the early waste package (WP) failure scenario class and the early drip shield (DS) failure scenario class in the 2008 YM PA.

For loose sand package, local failure surface observed however for dense sand package, a truncated cone shape failure surface was observed.