The bandgap properties of 2D 8-fold symmetric photonic quasicrystals (PQCs) composed of a set of rods are numerically investigated for various fill factors, dielectric constants and propagation angles using the finite difference time domain (FDTD) method.
In the numerical study, natural frequencies for various filling ratios of liquid of the cylindrical shells are analyzed and compared with the previous experimental and theoretical works for with and without the free-surface effect.
Further, the results on dynamic stability of partially liquid-filled slender cylindrical shells under constant and pulsating follower force for various filling ratios of the fluid are summarized.
This paper reports on a series of ion-instability observations at various fill patterns and beam currents using start-of-art NSLS-II diagnostic tools.
The design is obtained by adjusting the geometrical parameters after analyzing the reflection response of the proposed grating structure with various fill factor f, groove depth d and period p for the normal incidence TE-polarized light based on rigorous couple-wave analysis method.
In the present study, the crack initiation fracture toughness of various nanoparticles filled polyamide 66 was investigated in a broad temperature range (23 120 °C) by using an essential work of fracture (EWF) approach.
Energy ratios between the power flow in the fluid field and the power flow in the shell are evaluated, using a fully coupled analysis, for a steel and a hard rubber shell of various thicknesses filled with convected water and vibrating in the n = 0, 1, 2 and 3 circumferential modes.
The shutters of various cameras filled the silence after confused and concerned reporters stopped asking questions of a player clearly in physical distress.
This type of reservoir is characterized by serious heterogeneity, random distribution, and complex co-location of fractures and vugs, and various filling types and filling percentages of storage space.
This review paper summarizes various TSV fabricated technologies for 3D integration, including the processes development, Cu filling methods of various applications, and filling failure modes.
