With the development of high density interconnect (HDI), via-in-pad has emerged as one of the key enabling technologies for increasing the I/O density.
His research interests are in the areas of High Speed Interconnects, Low power VLSI Design, Carbon Nanotube based Designs, Organic Electronics; FinFET Device Circuit Co-Design, Electronic Design Automation EDAA), Spintronics based devices and circuits.
Device for investigating directional cell migration was composed of two isolated chambers (2 cm long 150 μm high) interconnected by narrow channels (1 mm long 0 μm high).
We study the performance of high-speed interconnects using a set of communication micro-benchmarks.
Reach extension of high capacity optical interconnects based on vertical-cavity surface-emitting lasers (VCSELs) and multimode fibers (MMFs), as needed for large-scale data centers, would benefit from high-speed GaAs-based VCSELs at 1060 nm.
Microchips that allow electrical products to turn off at periods of high demand could be interconnected with the not-yet-smart meters that we are about to have installed in our homes.
We found that ∼5 nm InGaAs QW with ∼6 nm barrier thickness is suitable for the active region of high-speed optical interconnect 980 nm VCSELs, and no significant improvement in the 20% range of In content of InGaAs QWs.
This phase included the complete removal of the i860 computers and Traq digitizer hardware and the incorporation of high performance Intel peripheral component interconnect (PCI) based computers fitted with 32 Channel PCI digitizers from D-TACQ corporation.
We report fabrication of three dimensional scaffolds with well interconnected matrix of high porosity using keratin, chitosan and gelatin for tissue engineering and other biomedical applications.
