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Evaluation results show considerable reduction in NoC power consumption and packet latency.
Reducing the NoC power is critical for scaling up the number of nodes in future many-core systems.
Simulation results show that the proposed architecture can reduce up to 47% through-silicon via (TSV) area footprint and up to 18% NoC power consumption with a slight performance degradation compared to a typical Symmetric 3D NoC.
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This paper presents a control-based methodology for the NoC power-performance optimization exploiting the Dynamic Frequency Scaling (DFS).
To solve two increasingly problematic issues, namely crosstalk interferences and wire power consumption, in a Network-on-Chip (NoC), Power-aware and Reliable Encoding Schemes Supported reconfigurable Network-on-Chip (PRESSNoC) is proposed.
On balance, the bit-sliced NoC with partial power-gating has a better tradeoff between performance and power-efficiency.
However, the shrinking feature size limits the performance of NoCs due to power and area constraints.
In this paper, we undertake a detailed design space exploration for 3D NoC by considering power-thermal-performance (PTP) trade-offs.
The Adapteva Epiphany many-core architecture comprises a 2D tiled mesh Network-on-Chip (NoC) of low-power RISC cores with minimal uncore functionality.
The Adapteva Epiphany many-core architecture comprises a scalable 2D mesh Network-on-Chip (NoC) of low-power RíSC cores with minimal uncore functionality.
For both NoCs estimates of power consumption are presented.
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CEO of Professional Science Editing for Scientists @ prosciediting.com