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There is an increasing need for compact desktop-size nanopositioning systems that can provide motion range of the order of several millimeters and yet achieve nanometric precision, resolution, and accuracy.
Its high resolution (nanometric precision) is based on the innovative confocal multi-pinhole technology in combination with the piezo module.
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Nowadays, the micrometric and nanometric dimensional precision of industrial components is a common feature of micro-milling manufacturing processes.
Single-crystal diamond is considered as the preferred tool material in ultra-precision and nanometric cutting operation.
And therefore in this paper, the key enabling technologies to design and fabricate the diamond-cutting tools for ultra-precision and nanometric machining are presented and reviewed.
High-precision-positioning technology with nanometric resolution plays a vital role in driving segmented mirrors in very large astronomical telescopes (VLAT).
Diamond is the hardest known naturally-occuring material and, for this reason, it is widely believed to be a superior cutting tool material for nanometric cutting of silicon for various ultra precision engineering applications.
For instance, ultra-precision and micro machining, with the surface roughness normally at the nanometric scale and features/patterns at the micrometer level, is increasingly and continuously demanded particularly for high precision components and products with improved functionality and performance.
Ultra-precision diamond turning is widely used in manufacturing the optical surfaces with nanometric accuracy.
Ultra-precision cutting is one of the most common methods in realizing the nanometric surface roughness and sub-micrometric form accuracy.
Ultra-precision machining (UPM) is capable of manufacturing a high quality surface at a nanometric surface roughness.
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