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In addition, the most uniform temperature distribution on the front panel was observed for the same connection position.
The co-flow case had the most uniform temperature distribution and the smallest thermal gradients, thus offers thermo-structural advantages over the other flow cases.
The Swirl plat with jet angle from 10° to 15° gives the most uniform temperature distribution and also the minimum pressure drop across the swirler.
In addition, the T-channel design has the minimum temperature difference and the most uniform temperature distribution, followed by the DL-, SL- and IGP-channel designs.
In addition, it is found that although uniformity in the thermal profile can be very effective in lowering the total power consumption, the most uniform temperature distribution does not necessarily correspond to the highest power savings.
The study shows that the power expenditure of the flow arrangement providing the most uniform temperature can be higher than the potential benefit, so the temperature distribution on the HHX casing may not be the only determinant of its quality.
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Furthermore, heat dissipation and pressure drop of structure 2 are both better and lower than that of structure 1. Form the viewpoint of temperature distribution, structure C2 (i.e., counter flow with rectangular channels in upper layer and complex channels in bottom layer) presents the most uniform bottom temperature for microelectronic cooling.
The results indicate that the most uniform furnace yielded a higher melting temperature by over 100 mK.
Flow-fields with channel assembled angles of 0°, 90° and 270° show most uniform membrane water content, current density and local temperature distributions, respectively.
The results show that there are optimum sizes of mandrel and driver rolls under which the strain and temperature distributions of ring and thus its microstructure are the most uniform where fishtail coefficient and power parameters have reasonable values.
As one of the most important components of micro-TPV system, it is essential that the micro combustor achieves a high and uniform temperature distribution along the outer wall.
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