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Dependencies of the interfacial stresses upon the adherend geometries, moduli and temperature are examined.
Parameter studies are performed to examine the dependencies of the interfacial stresses of the exemplified ABJ upon the geometries, moduli and temperature change of the adherends and adhesive layer, respectively.
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We report prediction of selected physical properties (e.g. glass transition temperature, moduli and thermal degradation temperature) using molecular dynamics simulations for a difunctional epoxy monomer (the diglycidyl ether of bisphenol A) when cured with p-3,3′-dimethylcyclohexylamine to form a dielectric polymer suitable for microelectronic applications.
Pertinent discussions and conclusions, related to the influence of CFRP moduli and subzero temperatures on the aforementioned parameters, are provided.
Structural and FTIR data of spinel ferrite are used for the estimation of elastic moduli and the Debye temperature.
The storage moduli and glass transition temperature of the copolymers increased in wet conditions with the increasing MPS content.
Sulfonated hard segment copolyesters displayed similar rubbery plateau moduli and decreasing flow temperature from 145 to 90 °C.
The effect of incorporating the imidazole on the host epoxy fracture toughness, complex moduli and glass transition temperature was also investigated.
The wave velocities were used to calculate the geomechanical properties (e.g. density, Poisson's ratio, volumetric strain, and elastic moduli) at different pressure and temperature conditions.
The successful prediction of the vibration transmissibility characteristics of viscoelastic structural elements is strongly dependent upon the use of fairly accurate estimates of the complex moduli, which are frequency and temperature dependent functions.
The dependence of various linear moduli on remanent quantities and temperature is obtained; the creep responses of the wafer at high temperatures are compared and discussed; and finally the domain-switching processes at different electric fields and temperatures are discussed in terms of reference remanent quantities.
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