To integrate all above functions, a sample manipulator was constructed featuring control of temperature over a wide range -- 20 K to 1000 K, six degrees of freedom for sample positioning, sample transfer with exchangeable sample-mounting modules to fulfill varied experimental needs.
Although ZP proteins generally contain the zona pellucida (ZP) structural modules to fulfill sperm recognition and EC polymerization functions during fertilization, the primary sequences of the ZP proteins from the above-mentioned animal classes are drastically different, which makes it difficult to assess the evolutionary relationships of ZP proteins.
Vertical decomposition layers the network architecture into several modules and horizontal decomposition provides distributed algorithms to fulfill the functionality within the modules.
An adaptive thermal control coldplate module (TCCM) was proposed in this paper to fulfill the requirements of modular thermal control systems for spacecrafts on-orbit services.
Samples were imaged using the uniform random sampling module of Leica LAS AF software in order to fulfill all statistically necessary criteria of randomized sampling.
Whole-cell bacterial bioreporters await miniaturized photon counting modules with high sensitivity and robust compatible hardware to fulfill their promise of versatile, on-site biosensor functionality.
Clearly, dendritic polymers, especially dendrons and dendrimers are expected to fulfill important roles as fundamental, reactive modules for nanoscale polymer syntheses.
To ensure the safe and reliable operation of the energy storage system, the single components such as the housing, the battery modules, the cooling system, as well as a battery management system have to fulfill challenging requirements.
To fulfill its specialist roles, the Ctf18-RFC clamp loader contains a unique module in which the Dcc1-Ctf8 complex is bound to the C terminus of Ctf18 (the Ctf18-1-8 Ctf18-1-8 Ctf18-1-8
To enable long life time of modules under higher operation temperature heavy copper wire bonding and diffusion soldering of chips are presented to fulfill the requirements.
