Technology can relate with protocols (e.g., OpenFlow as SDN protocol, routing protocols, cryptographic protocols), architecture paradigm (e.g., software-defined networking), implementations (e.g., SDN controller implementations, devices' firmware, operating systems) and hardware (e.g., used processors, Trusted Platform Modules, smart cards, USIM chips— Universal Subscriber Identity Module chips).
Qualcomm is already looking beyond its traditional chip-set business, with investments in wireless broadband modules, chip sets for netbooks and a mobile television service.
In 2008 Ed Felten and his team used nothing fancier than a can of compressed air to chill memory chip modules while a computer was running, remove them and pilfer critical data like passwords, which are temporarily stored in the modules' chips.
In this article we describe the architecture of the Module Controller Chip for the ATLAS Pixel Detector.
Sensors state monitoring is vital especially in alarm system or mining monitoring system.Traditonal monitoring method by wire conmmunication exists poor reliability and short transmitting distance.This paper designs a sensor state monitoring system based on LabVIEW and wireless nodes.RF905 wireless module,single chip microcomputer,serial bus and LabVIEW are used in the system.
Two types of flip-chip module were designed to have flip-chip on flex and flip-chip on glass.
In its new announcement, Samsung said it will recover components like OLED display modules, memory chips, and camera modules from Galaxy Note 7s and reuse them for repairs or recycle them.
The envisaged route to solving this problem offers high-throughput data interconnects on inter-chip and multi-chip module (MCM) level, facilitating implementation of new digital architectures and systems.
CAN bus communication system was designed as follow: the eCAN module of DSP chip TMS320F2407 was applied as CAN controller and the chip SN65HVD230 was applied as CAN transceiver, a variety of control modules was linked by the bus.
Based on the investigation of the structural and thermal characteristics of multi-chip module, the key performance indexes of multi-chip module that include the lowest internal temperature objective, thermal-transfer accuracy, chip placement are analyzed.
From the traditional conformal coatings used to protect printed wiring boards and insulate wire, coatings are now used as high performance dielectrics as an integral step in the processing of semiconductor chips, multichip module interconnect substrates, flip-chip devices, and ball-grid-array packages.
