Sentence examples for modification procedures were from inspiring English sources
The changes in the surface composition, morphology, philicity and thickness at each step of the polypropylene functionalisation confirmed that the surface modification procedures were successful.
To address this shortcoming, two different modification procedures were studied utilizing a high and a low crosslink density elastomer: base etching and the incorporation of acryloyl-poly ethylene glycol) (PEG)-Gly-acryloyl-poly ethylene) into the elastomer network duringlycolocrosslinking.
Nowadays, however, the UHMWPE modification procedures were improved [ 1- 4] and the total joint prostheses fail mainly due to aseptic loosening, infection, or instability [ 5].
Similar to extracellular action potentials, these usually have biphasic (bipolar) waveforms, and while modification procedures are likely to be different from those used in IPSC detection, the general algorithms can still be applied.
Because the c.p. Ti surface offers the advantage that additional modification procedures are unnecessary, the anodized and c.p. Ti surfaces were selected for peptide application.
The modification procedure was characterized via electrochemical impedance spectroscopy (EIS) and cyclic voltammetry (CV).
The modification procedure is also performed using polished GC for comparison with modified CNTs.
The modification procedure is based in the concept that oxidation of organic anions generates radicals which react with carbon surfaces.
At first, the modification procedure was achieved by the self-assembling of the sulphate starting complex, [Ru SO4)(NH3)4(pyS)]+.
The modification procedure was Ti ion implantation with simultaneous deposition of W (IBAD) and subsequent isochronal annealing in vacuum at temperatures ranging from 900 to 1500 °C.
A universal surface modification procedure was developed and performed from an optimized sequence of ultra-violet ozone pretreatment and trimethylamine-catalyzed zwitterionization on a selective case of versatile surfaces including silicon wafer, ceramic glass, titanium, steel, and polystyrene.
