Sentence examples for modification of substrates from inspiring English sources

Applications of this technology include the modification of substrates for cell culture, tissue engineering, and cell transplantation.

High-power impulse magnetron sputtering (HIPIMS) technologies have great potential for material processing and surface modification of substrates.

Engineering of chemical antagonists and inhibitors of ubiquitin ligases and DUBs has considerably aided the study of enzymes that participate in ubiquitin modification of substrates.

Finally, we discuss the challenges and future directions for pharmacologically targeting ubiquitin-modifying enzymes, as well as the development of proteomic methods to evaluate ubiquitin modification of substrates.

The modification of substrates using γ-ray irradiation provided a major advantage in that it did not require the use of catalysts or additives to initiate the reaction [ 31].

Modification of substrates is achieved through the concerted actions of a series of enzymes, starting with Ub activation by an E1 activating enzyme, transfer to any of a number of E2 conjugating enzymes, and finally substrate specificity is defined via an E3 ligase which recruits the substrate and E2 to mediate Ub transfer [ 2].

Techniques for patterned modification of substrate surfaces are important for the formation of microarrays on protein chips.

Engineering tests were conducted to assess coating removal rate, physical substrate damage, modification of substrate properties, and impact on subsequent paint adhesion.

This work shows that modification of substrate stiffness may represent a method for regulating arterial-venous differentiation for the fulfilment of diverse functions of the vasculature.

In this paper, we reported a complete fabrication process of InGaN LED involving a small modification of substrate by ultrafast laser.

The nanoporous PS thin film template was stabilized by modification of substrate using hydroxyl terminated PS so as to enhance the adhesion with substrate for following electroplating process.