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A sheet of commercially pure titanium grade 1 ASTM B 265 (William Gregory Ltd., UK) with a thickness of 1 mm was cut into 8 × 5 cm pieces using an automatic metal cutting machine.
In the mid-span of each beam, a single notch with depth of 25 mm and width of 3 mm was cut to localize the crack.
Commercial silicon wafer with a thickness of 0.50 mm was cut into square samples which were 10 × 10 mm2 in size.
A thick Zn foil (99.96 % purity and thickness 0.35 mm) was cut into a square size of 1.5 × 1.5 cm2 for conductive brass in the base holder of a Teflon cell.
Titanium (99.99 % pure), obtained from Goodfellow Cambridge Limited, in the form of foil of thickness 3.2 mm, length 50 mm, and width 50 mm was cut into several smaller targets by using Struers Accutom-50 precision cutter.
The patterns were recorded in steps of 100 K, in vacuum of the order of approximately 2 × 10−3 Pa for 30 min. For the cross-sectional transmission electron microscopy (XTEM) analysis, the specimen (10 mm × 10 mm × 0.5 mm) was cut into small rectangular pieces using a wire saw.
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Smaller coupons with a surface area of 20 mm × 50 mm were cut from a single sheet using a parallel metal cutting guillotine.
Sandwiched sample bars measuring 3 mm×4 mm×50 mm were cut and machined.
Mycelium discs of 5 mm were cut from 5 days old culture.
with a thickness of 0.5 mm were cut to 25 × 25 mm with a 20 × 20 mm hole.
Blocks of around 300 400 mm length and width and a height of 150 mm were cut out.
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