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The imaginary portion of the eigenvalues is characterized by a bi-material mismatch parameter ε = arctanh/π, where β is a Dundurs parameter, and the resulting fields do not contain stress singularity.
Figure 2 shows the plot of mismatch parameter at different temperatures and densities for fixed discharge current 100 mA and working pressure 4 × 10−3 mbar.
It is well known that the PSi lattice mismatch parameter is very sensitive to the chemical state of PSi internal surface [10, 11].
Open image in new window Fig. 5 Mismatch parameter σ for the discharge current 100 mA at constant pressure of 4 × 10−3 mbar with opacity and diffusion effects considerations.
Open image in new window Fig. 2 Mismatch parameter σ for the discharge current 100 mA at constant pressure of 4 × 10−3 mbar under thin plasma condition Open image in new window Fig. 3 Comparison of theoretical and experimental intensities at 100 mA and 4 × 10−3 mbar of pressure under thin plasma condition.
Variation of the mismatch parameter does not show a great effect (Figure S5).
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This chapter begins with the basic definitions of strain and mismatch parameters.
Relating mismatch parameters to specific effects in the application level would allow designers to apply focalized mismatch compensation techniques according to predefined performance/cost tradeoffs.
Four potential High Entropy Alloys, CrMoNbTiVWZr, Cr0.3NbMoTiZr0.3, Cr0.3NbMoTiV0.6Zr0.3 and Al0.6Cr0.3NbMoTiV0.6Zr0.3 have been designed using the indications provided by atomic radius and electronegativity mismatch parameters.
Using the H-integral approach, the effects of elastic mismatch parameters, the bond area and the thickness of the thin metal layer on the stress intensity factor are quantified and the results are compared with detailed finite element solutions.
According to this approach, the effects of the elastic mismatch parameters, the value of the notch angle and the thicknesses of the layers on the stress-intensity factor are carefully quantified and the results are compared with FE solutions.
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