Sentence examples for mismatch coefficient from inspiring English sources

The stress is affected by lattice mismatch, coefficient of thermal expansion mismatch, islands coalescence, grain growth, and gas impurity [17].

To achieve this, it is noted that for a given geometry and loading condition, the total ERR and bimaterial mismatch coefficient are the two main factors affecting the partitions of ERR.

Based on this, equivalent material properties are derived for each layer, namely, an equivalent elastic modulus and an equivalent Poisson's ratio, such that both the total ERR and the bimaterial mismatch coefficient are maintained in an alternative equivalent case.

where γ u, u = 1 − 2 − B u, u N t − 1 ; ∀ u is the mismatch coefficient for a given Bu,u which is the number of quantization bits for the serving BS and κ u, v = 2 − Bu, v N t − 1 ; v ≠ u is the quantization error coefficient for a given Bu,v v≠u which is the number of quantization bits for interfering BSs.

The best different flow direction is obtained which has the lowest flow mismatched coefficient.

For example, mismatched coefficients of thermal expansion bond formation in a thermoplastic composite, such as nylon 6/6 and glass fiber, which processes at melt temperatures of 280 295 °C would have sufficient stress when cooled to room temperature to undergo interfacial failure if the bond between the glass fiber to the nylon was "fixed".

However, the use of TSVs introduce a new set of reliability concerns, one of which is the thermo-mechanical stress caused by the mismatch in coefficient of thermal expansion (CTE) between the copper via and the surrounding silicon.

Another key process is the TSV extrusion or TSV pumping issue due to the mismatch in coefficient of thermal expansion (CTE) between the Cu material and Si substrate [42, 43].

High temperature processing of copper dual damascene structures leave the copper with a large tensile stress due to a mismatch in coefficient of thermal expansion (CTE) of the materials involved.

Bimaterial suspension legs consist of Parylene-C and titanium, the pair of which provides a high mismatch in coefficients of thermal expansion.

This is due to the isotropic tensile stress generated by the network TiCp structure and the mismatch of coefficients of thermal expansion (CTE) during the phase transformation.