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A novel maskless microplasma etching method based on parallel scanning probe microscopy is presented in this paper.
In this article new approach for high sensitivity measurements of electric surface properties using scanning probe microscopy is presented.
A characterization based on X-ray diffraction, differential scanning calorimeter, electron microprobe, and scanning electron microscopy is presented.
A detailed examination of the aging response in a quenched U 0.77 wt% Ti alloy using transmission electron microscopy is presented.
The most important stages of the analysis involve microscopy, an overview of which is given, and detailed information on optical stereo, optical compound and scanning electron microscopy is presented.
A cross-section image of the device performed by transmission electron microscopy is presented in Fig. 2e and shows the 3D stacking composed of three conductive layers (source, gate, and drain contacts), separated by two insulating layers with homogenous thicknesses and without any defect or damage in the dielectric layers or wave effect at the vicinity of the NWs.
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Structural characterisation using diffraction of high energy synchrotron light, transmission electron microscopy, scanning electron microscopy are presented together with hardness and wear data.
The main requirements for the development of highly luminescent chelates with potential applications in biomedical analysis and time-resolved luminescent microscopy are presented.
Detailed analyses of the transfer film, sliding surfaces of the ball counterparts, and wear surfaces of the coatings by optical microscopy, confocal microscopy, and atomic force microscopy are presented.
The results of the quantitative analysis of the microstructure of the Cu Fe and Cu V in-situ nanocomposite wires with diameter of 0.44 0.80 mm by transmission electron microscopy are presented.
The results from the blend characterization by tensile strength and electrical conductivity measurements, differential scanning calorimetry, UV Vis spectroscopy, X-ray diffraction and scanning electron microscopy are presented and discussed.
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