Sentence examples for methodology of stress from inspiring English sources

The advancements in the design methodology of stress corrosion cracking (SCC) have led to the recent developments in finite-element predictions of electrochemical conditions within cracks and crevices, together with finite-element predictions of the mechanical crack-tip loading, and a constitutive law describing the material environment interface at the crack tip.

We feel the importance of emphasizing the fact that the use of internal control in a chronic stress depression paradigm and behavioural assessment of the validity of its definition became possible only when the methodology of chronic stress model in tested strain of mice was essentially modified.

The methodology of the stress analysis of a particulate material consisting of an incompressible hyperelastic matrix and much stiffer elastic particles is also proposed in the paper.

In this study, we present a methodology for stress field estimation in areas where a detailed knowledge of the local stress conditions is unavailable.

Upon close examination of the youth stress literature, researchers employ inconsistent methodologies in the collection of stress data that they then use to draw their conclusions.

What is known about the role of minority stress and behavioral health risks among sexual minorities could be significantly improved with the future use of longitudinal methodologies and comprehensive assessments of stress with a cohort of sexual minorities.

The methodology involves an accurate prediction of stress and strain fields and residual strength prediction.

Four experiments employed a priming methodology to investigate different mechanisms of stress assignment and how they are modulated by lexical and sub-lexical mechanisms in reading aloud in Italian.

Recently we provided an experimental methodology to determine the full state of stress in Si wafers.

Furthermore, an improved methodology has been suggested for assessment of stress parametric equations.

An analytic methodology is presented for the examination of stress migration in the built up interconnect structures on integrated circuit die.