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(c) Typical I-V hysteresis characteristics of the resistive switching memory device with a MOS structure.
e Photograph of a flexible organic memory device with an AuNP floating gate.
Figure 25 Cross-sectional TEM image of the memory device with a Ag/GeS2/W structure.
We have fabricated a molecular memory device with atomically smooth BLG contacts.
A metal oxide semiconductor memory device with NiSi nanocrystal Al2O3/SiO2 double-barrier structure was fabricated.
Figure 4 I-V curve fitting of Pt/a-C H/TiN memory device with various carrier transPt/a-C H/TiNsmemory
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Resistive memory devices with cross-point architecture show promise to achieve high-density memory.
Thus, in this paper, we give the special attention to FeFET-based memory devices with nanostructures.
Furthermore, resistive switching memory devices with low-current operation (<100 μA) are also an important issue.
Flexible organic resistive memory devices with multilayer graphene electrodes were also reported [225].
Resistive switching memory devices with Ti/HfO2/Pt structure were fabricated as follows.
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