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Further, it was found that with an increase in the cast density, there was a drop in the median void diameter (D50) and for given density, the thermal conductivity decreases with an increase in the median void diameter.
As a result, the normalized median void diameter as well as the limiting packing density of the pressed tape was found to increase with the particle shape index, corresponding to wider void size distribution.
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This would be expected given that AlvetexScaffold has a slightly larger average void diameter.
Furthermore, the commercial AlvetexScaffold has an average void diameter of 42 μm.
The average interconnect diameter also decreases with increasing PFPA content, which is to be expected given that void diameter decreases (again refer to Table S2, Supporting Information).
The material has an average void diameter of 33 μm and an average interconnect diameter of 10 μm, compared to 69 and 15 μm, respectively, in the parent control SDE-polyHIPE.
The additional insulating effect of the inter-silica voids (median diameter D50 ≈ 15 nm) within the shell coating contributed also to the insulating properties of HSNS.
All fruit types have significantly different average void diameters.
ImageJ software was used to measure void diameters on each micrograph.
The simulation box was then created from the reduced voids' diameters and fractions with granular mechanics.
Voids' diameters and fractions of the actual microstructure were extracted with a deterministic locally adaptive thresholding technique.
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