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In this paper, the brittle ductile transition lapping mechanism is presented for mechanical lapping of single-crystal diamond cutting tools.
An analysis of the mechanics required to drive the holding mechanism is presented and an overview of microactuators and the state of the art in WCE is discussed.
The likely mechanism is presented.
Here, a comprehensive mechanism is presented.
In the last phase, the re-clustering mechanism is presented.
Finally, also the carrier load-balancing mechanism is presented.
A similar carrier synchronization mechanism is presented in [19].
A new Spherical Decoupled Mechanism is presented in this paper.
A structural basis for this difference in mechanism is presented.
The forward kinematics of the mechanism is presented.
In fact, a specific constraint-handling mechanism is presented.
More suggestions(15)
organization is presented
instrument is presented
arrangement is presented
arrangements is presented
instruments is presented
systems is presented
organizations is presented
mechanism is discussed
mechanism is called
mechanism is proposed
mechanism is used
mechanism is enabled
mechanism is broken
mechanism is found
mechanism is characterized
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