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In this study deformations were produced by grinding and mechanical polishing using abrasive particles.
Prior to NW and NT characterization, the Ni film formed on top of the NpAT was removed by mechanical polishing using alumina powder (particle size of 10 μm).
The adhesion between nanowires and Si substrate is strong enough to sustain the force of mechanical polishing using a Logitech precision lapping machine.
The specimens were prepared with a careful mechanical polishing, using graduated SiC paper of 240, 340, 400, and 600 grades, cooled in all cases with water.
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Lapping using diamond abrasives and conventional chemical mechanical polishing (CMP) using CeO2 slurry were conducted for comparison with the proposed atmospheric-pressure-plasma-based finishing process.
The fourth method consists of chemical polishing using mechanical assistance or electrochemical reaction [40, 41], but the film and nanostructure will be attacked during the polishing process.
Sludge, a byproduct of chemical mechanical polishing (CMP) used in integrated-circuit (IC) industries, is composed of hazardous materials such as nano-particles of SiO2, Al2O3, CaF2, and unknown organics.
Generation of electrolytic ionized water (EIW) from chemical mechanical polishing (CMP) wastewater using a simultaneous crossflow electrofiltration/electrodialysis process was studied in this work.
A step-wise mechanical polishing method was used to remove successive sublayers of the treated surface.
Cross sectional samples were prepared by mechanical polishing and ion milling using the standard procedure.
The XTEM specimen was prepared by a conventional method using mechanical polishing and ion thinning in a Gatan PIPS device.
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