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The mechanism of magnesium anodizing after mechanical polishing or HF pickling was studied.
To achieve a shorter cavity length, the residue n-GaN layer was thinned and polished to about 1.5 μm by ICP-RIE and mechanical polishing process.
The finishing methodology consists of mechanical polishing followed by chemo-mechanical polishing.
Besides, it can avoid the conventional chemical mechanical polishing process.
Silicon wafers are polished by megasonic assisted chemical mechanical polishing and traditional chemical mechanical polishing respectively, both coarse polishing and precision polishing experiments were carried out.
To planarize the coil, we employed chemical mechanical polishing (CMP) in our fabrication process.
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The best result of CMMRF finished aluminum (0.597 nm) was way better than DTM and chemo-mechanical polishing process.
During chemical-mechanical polishing (CMP), the polishing pad is placed under a wafer and it completely covers the wafer.
Nanotechnology has had several commercial applications in advanced laser technology, hard coatings, photography, pharmaceuticals, printing, chemical-mechanical polishing, and cosmetics.
SiNWs were then embedded into spin-on-glass matrix in order to be planarized by chemical-mechanical polishing [16].
Recently, the so-called chemical-mechanical polishing (CMP) has been applied to the fine processing of electronic devices[15].
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