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Our group is developing chip-scale systems and devices that process electromagnetic, optical, and mechanical fields in qualitatively new ways.
The formulation is based on two-dimensional Fourier series expansions of relevant mechanical fields in the continuum of the layer.
In the present work, we perform an asymptotic analysis of the mechanical fields in the vicinity of a propagating mode I crack in rubber.
Asymptotic analyses of the mechanical fields in front of stationary and propagating cracks facilitate the understanding of the mechanical and physical state in front of crack tips, and they enable prediction of crack growth and failure.
Furthermore, the mechanical field formulated in the present paper is coupled with the thermal, electrical, and chemical multiphysics fields simultaneously, while the mechanical fields in the published works were coupled with either the thermal or electro chemical field only.
Through the analysis of the mechanical fields in the proximity of the contact edges, it has been possible to extract nonlocal intensity factors that take into account the stress gradient evolution.
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By using the transfer-matrix method along with an asymptotic expansion technique of small parameter, closed-form solutions for the mechanical field in the film is presented in terms of the displacements on the mid-plane.
Experimental evidences on the decay of the mechanical modulus of concrete have allowed for implementing the required damage law within a 3D F.E. research code which accounts for the coupling among moisture, heat transfer and the mechanical field in concrete treated as a fully coupled porous medium.
The predicted intragranular mechanical fields are in qualitative good agreement with experimental observations, in particular those involving the formation of shear and kink bands.
In the thermal part, we follow the investigations of Simó and Miehe (1992) that demonstrate the effect of temperature on the mechanical fields resulting in a thermal expansion.
Relevant mechanical fields computed in an FE simulation at the specimen scale are used as boundary conditions for the micromechanical simulation, where the real microstructure is meshed from 3D X-ray images.
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