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The coupled photo-induced electrical, thermal, and mechanical fields are considered in the formulation.
The stress intensity factors of electrical and mechanical fields are dependent.
The real stress intensity factors of electrical and mechanical fields are then independent.
The predicted intragranular mechanical fields are in qualitative good agreement with experimental observations, in particular those involving the formation of shear and kink bands.
Since the proposed microscale model is based on a continuum formulation of the magnetomechanical boundary value problem, the local magnetic and mechanical fields are resolved explicitly within the microstructures.
The choice of stimulus is quite broad, but needs to be able to be applied locally to induce the reflection change in a single pixel without crosstalk – thus, heat, or light or electric or mechanical fields are all possible but vary greatly in their practicality.
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Full coupling between the thermal, electrical and mechanical fields is taken into consideration.
The influence of the material property gradient index on the variables of electric and mechanical fields is studied.
Finite-element simulations, coupling thermal, electrical and mechanical fields, were used to explain the deformation behaviour of the different samples.
For this purpose, a fully coupled, multiphysics, dynamic finite-element model, which solves for the thermal, electric and mechanical fields is used.
FE mechanical fields were calculated using two types of boundary conditions: the displacements measured by DIC, and the average of the displacements measured by DIC.
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