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This paper deals with the development of methodology suited for design of computation algorithm which is able to determine power losses of electronic systems based on measured temperature distribution (thermo-vision measurements).
However, the trend of the measured temperature distribution could be reproduced even for this depth.
c SiNM-diode-based wearable temperature sensor located on a heated metal element (left) and the measured temperature distribution (right).
Within this limit, the measured temperature distribution quantitatively agrees with a numerical simulation.
In addition, the experimental results demonstrate that the measured temperature distribution is in good agreement with the simulated result.
Figure 2c depicts an 8 × 8 p i n junction diode array located on a heated Cu element (left) and its measured temperature distribution (right).
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Measured temperature distributions are compared with those calculated that are based on our previous study.
In addition, we measured temperature distributions and found that temperatures increase continuously with increasing partial premixing.
Measured temperature distributions indicated radial isothermal operation of the catalysts under the most severe conditions investigated.
The calculated results obtained from the mathematical model are compared with experimental data, and good agreement is observed between the predicted and measured temperature distributions across the micro-LHP.
This device can also be used to measure temperature distribution if temperature sensors are used instead of that for gas concentration measurement.
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