Sentence examples for maximum stress drop from inspiring English sources

The maximum stress drop was 9.5 MPa (Fig. 4c) near the largest slip area (Fig. 1a).

By using mean-field theory (MFT), maximum elastic-energy density at different strain rates could be predicted by MFT besides maximum stress drops during serrations.

The moderate aftershock activity taking place at the same along-strike distances [Fig. 4b: (−5 to −15 km), along strike] as the maximum shear stress drop reflects mainly deeper aftershock activity (i.e., below the large slip area, see Figs. 1a, 4c).

CTEs of sealant and electrolyte can be also optimized as analysis confirms that the maximum stress in electrode drops when the CTEs of sealant and electrolyte decrease.

The corresponding maximum compressional-stress drop of the northeast coast of Honshu then is estimated to be 3.9×106 Pa, while the average compressional stress along the tangential arc indicated in Fig. 5 is approximately 2.8×106 Pa.

Our analysis concludes that, compared with the corresponding homogeneous structure, symmetrical negative-exponent gradient active plates or positive-exponent gradient bilayer electrodes can significantly reduce the maximum compressive stress and the stress drop at the electrode collector interface, while the energy release rate of interface delamination is slightly weakened by it.

Maximum tsunami height distributions for different values of stress drop in light gray and dark gray.

For example, in the case of the M7.4 Landers earthquake, the maximum stress changes calculated at epicentral distances more than ~4 times the fault-length drop below ~1 3 kPa (Hill et al. 1993); such values are much smaller than the dynamic stress changes at similar distances.

Hardness values underwent only modest drops, the greatest decrease being seen for fatigue under a maximum stress of 450 MPa.

The peak value of out-of-plane displacement of printed circuit board (PCB), when it is subjected to drop impact, is a major concern to electronic manufacturers as it relates to the maximum stress causing failure for the solder balls.

In the simulations, we examine various values of the magnitudes of the maximum and minimum principal stresses, slip-weakening distance (D_{text{c}}), and the ratio of the yield stress and the stress drop on the Hinagu fault (S_{text{H}}), as a set of independent parameters, assuming a slip-weakening law.