Values were chosen based on a maximum cutting length on the microscope/LMD system of 650 μm.
Particularly, the thrust force fluctuates with a maximum amplitude of about 550 nN, at a cutting distance of around 52 nm.
Figure 4 shows hydrostatic pressure and the maximum shear stress in the silicon workpiece at the cutting distance of 50 nm.
Figure 6 Variations of the cutting forces with the cutting distance.
The cutting distance of the model is about 40 nm.
The distance of the materials starting to be extruded increases with the cutting distance.
In the process of nano-cutting, the depth of subsurface deformed layers increases with the cutting distance at the beginning, then decreases at stable cutting process, and basically remains unchanged when the cutting distance reaches up to 24 nm.
The variations of the cutting forces with the cutting distance during the cutting process for this simulation case are shown in Fig. 6.
It can be found that the depth of SSD layer dose vary with the cutting distance, cutting depth, and cutting speed.
(2) When the cutting depth remains constant, the depth of SSD layers increases when the cutting distance increases to be less than 8 nm, and then decreases when the cutting distance is between 8 and 24 nm.
