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Wattanasakulpong and Chaikittiratana (2015) investigated the free vibration characteristic of stiffened doubly curved shallow shells made of functionally graded materials under thermal environment.
A hybrid model by integrating TTM (two-temperature model) and MD (molecular dynamics) is proposed to investigate the properties on interface of dissimilar materials under thermal flux conditions.
The main goal of the paper is to design and implement a framework based on the cellular automata (CA) method, which is dedicated to numerical simulations of microstructure evolution in metallic materials under thermal and mechanical processing.
This paper presents a modified interaction energy integral method to analyze the thermal stress intensity factors (TSIFs) and electric displacement intensity factor (EDIF) in nonhomogeneous piezoelectric materials under thermal loading.
The pyrolysis models undergoes a fast development due to the enhancement of both the computational power and the new test used to characterize the behaviour of materials under thermal stresses, which were widely used in the field of the chemical engineering to obtain the reaction rates.
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The behaviour of the composite material under thermal, thermo-chemical and mechanical loads is studied.
Based on 3D elasticity theory, thermoviscoelastic analysis of cylindrical panel made by functionally graded materials (FGMs) under thermal and/or mechanical load is carried out.
The experiment is a valuable step in establishing the viability of the reference concept, and making progress in the understanding of the behavior of buffer material under thermal-hydro-mechanical (THM) coupled condition.
HEAIM was employed to characterize and evaluate the thermal and constitutive behavior of substrate trilayer structure and its constituent materials under a thermal cycle.
Preceding works on the buckling of advanced materials, e.g., functionally graded materials, under combined thermal and mechanical loads are rather rare in literature.
As an example, the concept is applied to the analysis of an adhesive bond of metallic and ceramic materials under severe thermal loading conditions as they occur, among other examples, in high temperature fuel cell technology.
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