Sentence examples for materials of electronic from inspiring English sources
To fabricate thermally conductive while electrically insulating composites with excellent antistatic property is a huge challenge in the region of packaging materials of electronic devices due to the contradiction between the electrical insulation and the antistatic property.
A plasma immersion ion implantation (PIII) system is described which provides the capability to bridge the range between research exploration and commercial applications for materials modification of electronic materials, with a particular focus on layer transfer processes.
In addition, the optimum material design of electronic liquid powder for high quality and stable performance is reported.
π-Conjugated polymers have become an important class of materials for electronic devices.
Superlattices were introduced 40 years ago as man-made solids to enrich the class of materials for electronic and optoelectronic applications.
Currently, his research activities are focused on printing technologies such as inkjet, R2R and pad printing of materials for electronic applications.
Therefore, the flagella biological properties combined with synthetic chemistry have promising prospect in the fabrication of useful materials for electronic devices with high yield and functionality.
These findings indicate that journals appear slow to grant free access to older materials, which typically involves conversion of print materials to electronic PDF files.
In solid-state materials, the modification of electronic states (including spin states) at the interface and on the surface can strongly affect the electronic and magnetic properties of materials.
This paper focuses on the capabilities and development prospects of nanostructured metal oxides (MOX) representing the most versatile and richest class of materials in terms of electronic structure and structural, chemical, and physical properties.
The effect of a strongly oxidizing environment (105 °C/100%RH) on tin whisker formation has been studied with Ni and Ag underlayered samples between the tin surface coating and the bronze base material of the electronic components leads.
