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It can be seen that the material removal mode of the abrasive particles is plastic deformation.
At the moment, the material removal mode has changed from cleavage to HPPT.
The above results show that during the nanometric cutting process of silicon, the change of material removal mode can cause the severe fluctuation of the cutting forces.
(4) According to the material removal mode, the (100)[0 10], (110)[−110], and (111)[−101] crystal directions, compared with the other direction on the same crystal plane, are found to be more suitable to be removed in ductile mode.
It can be found that only the (100)[0 10] and (111)[−101] directions can be completely removed in the ductile mode among the six selected directions, according to the analysis of the material removal mode.
(3) During nanometric cutting process of silicon, the change of material removal mode can cause the obvious fluctuation of the thrust force and the tangential force, and the amplitude of the former is much larger than the latter.
Similar(51)
Combined SEM/EDX analyses reveal a number of material removal modes.
A model of Bello and Wood (2005) [33] for filled polyamides is adapted and extended in order to systematically register different material removal modes.
A special focus was made on the material removal modes and tool wear mechanisms dominating the bi-material interface consumption (BIC) with respect of investigating strategies used.
Furthermore, the wear coefficients were calculated through measuring the material removal depth, the surface morphologies were measured by a scanning electron microscopy in revealing the different material removal modes under various different polishing parameters.
AFM observation of the ground surface also showed that material removal in the ductile mode occurs for fine abrasive wheels.
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