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There are other benefits of scaling down the amount of costly inorganic semiconductive material is reduced.
When the size of a material is reduced from micrometer to nanometer, the resultant properties can change dramatically.
However, the strength of the material is reduced because the material temperature reaches the recrystallization temperature during hot working.
The smaller peak intensities together with the broader peak widths, however, show that the ability of crystal formation for the 19 kg/mol material is reduced.
In these samples we observe a systematic reduction of heats of reaction, maximum reaction temperatures, and reaction propagation velocities as the volume fraction of reactive material is reduced.
The melting time of the phase change material is reduced by 46% whilst only reducing the energy storage density by 18%.
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Furthermore, the amount of material was reduced up to 50%.
The volume of the material was reduced by 42% at the highest applied pressure.
The adhesive wear may change into slight abrasive wear, and the wear degree of the material was reduced.
After applying the reflectors, wider silver fingers, and smaller cells were recommended for large area modules, and the influence of the width of sealing material was reduced.
After 2 weeks of implantation, the COLLOSS® material was reduced in size inside the loaded implants, but no bone-like tissue formation was evident.
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