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First, our material design concept is introduced in relation to the electronic structures of the oxides.
This coupled geometry and material design concept is enabled by the state-of-the-art additive manufacturing technique.
We present a new material design concept, silicon quantum dot (Si QD) polymers, for which surface-functionalized Si QDs can be regarded as a large monomer in the polymers.
By adopting an advanced material design concept that combines a composite with a shape memory alloy (SMA), a structure was developed that not only has the characteristics of the composite, such as high specific strength and an adjustable design, but also the shape memory effect of the SMA.
Among the efforts to optimize the high temperature thermoelectric properties of various PGEC thermoelectric materials, recent experimental works on the Skutterudite IrSb3 and half-Heusler TiNiSb intermetallic compounds are presented herein by which the material design concept for high energy conversion efficiency, i.e. a high figure of merit, is suggested.
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Conduction mechanism and the material design concepts are discussed based on the conduction behavior and the structure considerations.
This model demonstrates the role of matrix in energy dissipation, and stimulates new advanced material design concepts for ballistic applications.
Since the proposed material model is mechanism-based, macroscopic performances are functions of microstructural variables describing the polymer chemistry so that parametric material design concepts may be gleaned from the model.
We propose a new materials design concept based on the use of regular assemblies of topologically interlocked elements.
Dyskin et al. (2003) proposed a new materials design concept in which regular assemblies of topologically interlocked elements are the basis for strong flexible composite materials with high impact resistance.
Therefore, parametric materials design concepts can be easily gleaned from the model, which is also demonstrated in this study.
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