Then, we used the 4-million-atom model, which is shown to be large enough to eliminate the boundary effect, to study the detailed materials deformation, dislocation movement, and cutting forces during the cutting processes.
Figure 7 Material deformation and dislocations for the cutting depths of (a) 0.8 nm, (b) 2.0 nm and (c) 4.0 nm.
A detailed study on the material deformation, lattice defects, dislocation movement, and cutting forces during the cutting process is made with the 4-million-atom model.
Figure 7a c show material deformation, chip formation, and dislocations during the cutting process for the cutting depths of 0.8, 2.0, and 4.0 nm, respectively.
The material behavior, surface and subsurface deformation, dislocation movement, and cutting forces during the cutting processes are studied.
After the nanocutting process and a long enough stage of relaxation, the copper atoms on the machining-induced surface reconstruction and finally some vacancy-related defects are located on the surface, which derive from the propagation of dislocations in material deformation.
It is observed that the nanometric cutting process is accompanied by complex material deformation, chip formation, lattice defect generation, and dislocation movement.
A material deformation postulate leads to structured mixtures.
In summary, we have developed a diffuse-interface model for polycrystalline materials deformation that expresses grain boundaries as a special class of geometrically necessary dislocations, such that the stress-free nature of the polycrystalline structures obtained is naturally recovered.
