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Based on various IP traceback approaches described in Section 2, PPM falls into the following categories: basic principle - marking, processing modes - probabilistic, and location - network group.
The first aim of the study was to establish the temperature model of the eggshell by the finite element analysis software ANSYS and realize the eggshell temperature field based on the laser marking processing.
Based on various IP traceback approaches described in Section 2, DFM falls into the following categories: basic principle - marking, processing modes - deterministic at flow level, and location - source group.
Based on various IP traceback approaches described in Section 2, DFM falls into the following categories: basic principle - marking, processing modes - deterministic at packet level, and location - source group.
Marking processing - a processing method for physical removal - has been tested for storage devices [3].
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The system utilized a component-based architecture with a text pre-processing phase and a word/synonym matching phase to automate the marking process.
Marked processing of caspase-3, generating the active 17 kDa fragment, and a slight reduction of procaspase-8 levels were only detected following treatment with TRAIL/bortezomib but not TRAIL alone.
The superior limbus was marked before processing because we tried to assess the location of a possible filtering surgery and to compare similar areas in two eyes; because there may be a change according to the location, there should be less depot medications, nasal and temporal greatest environmental exposure and keratinization.
Hence, if a laser is to be used for part marking components then the processing parameters should be carefully selected in order to prevent the formation of microcracking and limit the depth of marking.
The specific marking preparation steps, typical processing conditions and a representative set of results are presented for LISI™ laser marking of AISI 4340 steel with Cr-CrB2, and 2024 aluminum with WC. Results include transverse cross-sectional views and hardness measurements of the marked material, and data on the concentration of alloying compounds within the laser melted layer.
The white dashed frames with white capital letters (A, B, and C) mark the three processing areas (data were inverted separately in each area).
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