Exact(1)
Similar to existing activated carbon supercapacitor industry, roll-to-roll manufacturing compatibility is an ideal feature for the flexible supercapacitor materials.
Similar(59)
Organic bulk heterojunction solar cells using n-type inorganic metal oxide nanostructures as the electron transport channel have attracted considerable attentions because of its improved ambient device stability, low-cost manufacturing, and compatibility to solution fabrication process [1 4].
In comparison with silicon photovoltaic cells, DSSCs exhibit some specific advantages including easy fabrication procedures, low manufacturing cost and compatibility with flexible substrates.
Nevertheless the simultaneous achievement of high luminous efficacy (LE), high color rendering index (CRI), very low manufacturing costs and compatibility with flexible thin substrates is still a great challenge.
Therefore, it is challenging to apply this cleaning procedure into commercial manufacturing due to facility compatibility and drug safety concerns.
One of the major challenges in the microbattery field is related to the manufacturing process and its compatibility with the integrated circuit technology.
This paper examines the effects of organizational macroergonomic compatibility elements over manufacturing systems performance from four companies located in the city of Ciudad Juarez, México.
In addition to the nature of the adhesive, other important factors to consider include surface pretreatment, substrate compatibility, joint design, manufacturing demands, quality control and end of life requirements.
Light-emitting Si-ncs embedded in dielectric hosts have potential applications in optoelectronic devices because of their compatibility with the existing manufacturing infrastructure for silicon integrated circuits.
Solution-processed approach for the deposition of Cu2ZnSn (S,Se)4 (CZTSSe) absorbing layer offers a route for fabricating thin film solar cell that is appealing because of simplified and low-cost manufacturing, large-area coverage, and better compatibility with flexible substrates.
This paper deals with the use of two main standard modeling approaches in order to control the electromagnetic compatibility of an IC before manufacturing.
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