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Fig. 8 Variation of tangential force Fy with roller machining distance for roller rotation direction of clockwise and counterclockwise.
The accumulation of removed atoms around the roller increased with the roller machining distance for each film under both clockwise and counterclockwise roller rotation directions.
Fig. 4 Variation of tangential force Fy with roller machining distance for Cu film with roller rotation velocities of 0, 5, 10, and 20°/ps, respectively.
Figure 6 shows the tangential force Fy as a function of roller machining distance for Cu films at temperatures of 150, 300, 450, and 750 K.
Fig. 6 Variation of tangential force Fy with roller machining distance for temperatures of 150, 300, 450, and 750 K, respectively.
Figure 4 shows the tangential force Fy as a function of machining distance for Cu films with different roller rotation velocities of (a) 0°/ps, (b) 5°/ps, (c) 10°/ps, and (d) 20°/ps.
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Fig. 2 Variation of slip vector distributions of Cu film at a machining distance of 8 nm for roller rotation velocities of a 0°/ps, b 5°/ps, c 10°/ps, and d 20°/ps.
Fig. 5 Snapshots of the slip vector and deformation mechanism of the Cu films at a machining distance of 8 nm for temperatures of a 150 K, b 300 K, c 450 K, and d 750 K, respectively.
We used MD simulations to study the influence of roll and scratch processing on Cu films formed at 298 K. Figure 2 shows the slip vector distributions of Cu films at a machining distance of 8 nm for roller rotation velocities of (a) 0°/ps, (b) 5°/ps, (c) 10°/ps, and (d) 20°/ps, respectively.
(G_m) Relocation cost per unit distance for machine (m).
It takes more time and cutting distance for the atoms in the zone to determine whether to be a part of chip or machined surface.
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