The inherent disadvantage of EDM is low machining rate and inferior machined surface.
It is found that high quality of machined surface and low machining force can be achieved in the diamond cutting of cerium with the optimal machining conditions, i.e., a rake angle of 30° for a crystal orientation of (010).
A low machine power causes a non-uniform deformation zone while grinding lubrication gave a more uniform deformation zone.
Increasing pulse-off time decreases the effective discharge frequency and hence decreases the discharge energy across the electrodes resulting in low machining rate.
Due to low machining yield and dimensional control, there is an strict requirement for optimizing the governing machining parameters of EDM.
Therefore, it is indicated that the crystal orientation of (010) is optimal for the diamond cutting of cerium due to its low machining force, low dislocation density, and low surface pile up.
From the parametric analysis, it is revealed that, the combination of low feed rate, low depth of cut and low machining time with high cutting speed is beneficial for minimizing the machining force and surface roughness.
The low machine power (30%) induced a large amount of small smearing areas or adhesive chips along the grinding surface, which agrees with the results from the surface topography investigation, while very few cold welded chips resulted.
This paper presents the processing conditions for the ablation of approximately 4-μm-thick coatings of TiN in the ns pulse regime, which is generally characterised by higher productivity with low machining quality.
However, in addition to its low machining efficiency, UPFC's intermittent cutting process results in distinctive surface generation mechanisms, covering intermittent tool-workpiece relative motion, tool geometry imprinted into a machined surface, and surface material separation and deformation.
